Keith Price Bibliography Inspection -- Chips, Wafers, PCB, PWB, VLSI, IC, Disks, etc.

Hara, Y., Akiyama, N., and Karasaki, K.,
Automatic Inspection System for Printed Circuit Boards,
PAMI(5), No. 6, November 1983, pp. 623-630. Vertical and diagonal lighting to make the metal pattern more obvious, then the inspection becomes easier. BibRef 8311

Hara, Y., Okamoto, K., Hamada, T., Akiyama, N., Nakagawa, K., Torisawa, S., and Nakashima, S.,
Automatic Visual Inspection of LSI Photomasks,
ICPR80(273-279). BibRef 8000

Sanz, J.L.C., and Petkovic, D.,
Machine Vision Algorithms for Automated Inspection of Thin-Film Disk Heads,
PAMI(10), No. 6, November 1988, pp. 830-848.
IEEE Abstract.
IEEE DOI Link Inspection, Disk Heads. Real system to inspect disk head assemblies. Not much new from the vision point of view, except that it works. BibRef 8811

Sanz, J.L.C., Dinstein, I., and Petkovic, D.,
Computing Multi-Colored Polygonal Masks in Pipeline Architectures and Its Application to Automated Visual Inspection,
CACM(30), No. 4, April 1987, pp. 318-329. The different templates (colors of polygons) are used to find features in the image which can then be closely inspected. BibRef 8704

Petkovic, D., Hinkle, E.B.,
A Rule-Based System for Verifying Engineering Specifications in Industrial Visual Inspection Applications,
PAMI(9), No. 2, March 1987, pp. 306-311. BibRef 8703

Dom, B., Steele, D., Petkovic, D., Kuhlmann, L.,
Algorithms for automatic disk head/slider inspection,
ICPR94(A:295-300).
IEEE DOI Link 9410
BibRef

Petkovic, D., Sanz, J.L.C., Mohiuddin, K., Hinkle, E.B., Flickner, M.D., Cox, C., Wong, K.,
An Experimental System for Disk Head Inspection,
ICPR86(9-13). BibRef 8600

Sprague, A.P., Donahue, M.J., and Rokhlin, S.I.,
A Method for Automatic Inspection of Printed Circuit Boards,
CVGIP(54), No. 3, November 1991, pp. 401-415.
WWW Version. Find features in the pattern and match to features in the reference graph pattern. BibRef 9111

Wojcik, Z.M.[Zbigniew M.],
An Approach to the Recognition of Contours and Line-Shaped Objects,
CVGIP(25), No. 2, February 1984, pp. 184-204.
WWW Version. Recognize Line Models. The use of some line analysis techniques that extend to PCB inspection. BibRef 8402

Ellison, T.P.[Timothy P.], Taylor, C.J.[Christopher J.],
Calculating the surface topography of integrated circuit wafers from SEM images,
IVC(9), No. 1, February 1991, pp. 3-9.
WWW Version. 0401
BibRef
Earlier: BMVC90(xx-yy).
PDF Version. 9009
BibRef

Yu, K.K.[Kenneth K.], Berglund, C.N.[C. Neil],
Automated system for extracting design and layout information from an integrated circuit,
US_Patent5,086,477, Feb 4, 1992
WWW Version. BibRef 9202

Lebeau, C.J.[Christopher J.],
Method for automatic semiconductor wafer inspection,
US_Patent5,129,009, Jul 7, 1992
WWW Version. BibRef 9207

Bushroe, M.W.[Michael W.],
Solder joint locator,
US_Patent5,164,994, Nov 17, 1992
WWW Version. BibRef 9211

Dom, B.E., Brecher, V.,
Recent Advances in the Automatic Inspection of Integrated-Circuits for Pattern Defects,
MVA(8), No. 1, 1995, pp. 5-19. BibRef 9500

Khalaj, B.H., Aghajan, H.K., Kailath, T.,
Patterned Wafer Inspection By High-Resolution Spectral Estimation Techniques,
MVA(7), No. 3, 1994, pp. 178-185. BibRef 9400

Teoh, E.K., Mital, D.P.,
A Transputer-Based Automated Visual Inspection System for Electronic Devices and PCBs,
OptLas(22), No. 3, 1995, pp. 161-180. BibRef 9500

Moganti, M., Ercal, F., Dagli, C.H., Tsunekawa, S.,
Automatic PCB Inspection Algorithms: A Survey,
CVIU(63), No. 2, March 1996, pp. 287-313.
WWW Version. Survey, Inspection. BibRef 9603

Rao, A.R.,
Future-Directions in Industrial Machine Vision: A Case-Study of Semiconductor Manufacturing Applications,
IVC(14), No. 1, February 1996, pp. 3-19.
WWW Version. 9608
BibRef

Yuan, M.C., Li, J.G.,
A Production System for LSI Chip Anatomizing,
PRL(5), 1987, pp. 227-232. BibRef 8700

Blanz, W.E., Sanz, J.L.C., Hinkle, E.B.,
Image Analysis Methods for Solder-Ball Inspection in Integrated Circuit Manufacturing,
RA(4), 1988, pp. 129-139. BibRef 8800

Chou, P.B., Rao, A.R., Sturzenbecker, M.C., Wu, F.Y., Brecher, V.H.,
Automatic Defect Classification for Semiconductor Manufacturing,
MVA(9), No. 4, 1997, pp. 201-214.
HTML Version. Visual Inspection. BibRef 9700

An, J.N., Cho, Y.B., Gweon, D.G.,
A New Method for Image Separation of Overlapped Images from a Two-Layered Printed Circuit Board (PCB),
IVC(15), No. 11, November 1997, pp. 861-866.
WWW Version. 9712
BibRef

Kim, S.W., Lee, S.Y., Yoon, D.S.,
Rapid Pattern Inspection of Shadow Masks by Machine Vision Integrated with Fourier Optics,
OptEng(36), No. 12, December 1997, pp. 3309-3311. 9801
BibRef

Zhou, H., Kassim, A.A., Ranganath, S.,
A Fast Algorithm for Detecting Die Extrusion Defects in IC Packages,
MVA(11), No. 1, 1998, pp. 37-41.
HTML Version. 9808
BibRef

Kassim, A.A., Zhou, H., Ranganath, S.,
Automatic IC orientation checks,
MVA(12), No. 3, 2000, pp. 107-112.
HTML Version. 0010
BibRef

Nichani, S.[Sanjay], Scola, J.[Joseph],
Semiconductor device image inspection utilizing image subtraction and threshold imaging,
US_Patent5,949,901, Sep 7, 1999
WWW Version. BibRef 9909

Ichikawa, I.[Iwao],
Laser beam inspection apparatus,
US_Patent6,618,135, Sep 9, 2003
WWW Version. BibRef 0309

Chung, H.K., Park, R.H.,
2-Stage High-Precision Visual Inspection of Surface Mount Devices,
JEI(6), No. 4, October 1997, pp. 517-524. 9807
BibRef

Moganti, M.[Madhav], Ercal, F.[Fikret],
A Subpattern Level Inspection System for Printed Circuit Boards,
CVIU(70), No. 1, April 1998, pp. 51-62.
WWW Version. BibRef 9804

Moganti, M.[Madhav], Ercal, F.[Fikret],
Segmentation of Printed Circuit Board Images into Basic Patterns,
CVIU(70), No. 1, April 1998, pp. 74-86.
WWW Version. BibRef 9804

Fadzil, A.[Ahmad], Weng, C.J.[Chu Jenn],
LED Cosmetic Flaw Inspection System,
PAA(1), No. 1, 1998, pp. 62-70. BibRef 9800

Rodriguez, A.A., Mandeville, J.R.,
Image registration for automated inspection of printed circuit patterns using CAD reference data,
MVA(6), No. 4, 1993, pp. 233-242. BibRef 9300

Rajeswari, M., Rodd, M.G.,
Real-time Analysis of an IC Wire-bonding Inspection System,
RealTimeImg(5), No. 6, December 1999, pp. 409-421. 0003
BibRef

Beaty, E.M.[Elwin M.], Mork, D.P.[David P.],
Three dimensional inspection system,
US_Patent6,055,054, Apr 25, 2000
WWW Version. BibRef 0004

Xie, P.[Pin], Guan, S.U.[Sheng-Uei],
A golden-template self-generating method for patterned wafer inspection,
MVA(12), No. 3, 2000, pp. 149-156.
HTML Version. 0010
BibRef

Guan, S.U.[Sheng-Uei], Xie, P.[Pin], Li, H.[Hong],
A golden-block-based self-refining scheme for repetitive patterned wafer inspections,
MVA(13), No. 5-6, 2003, pp. 314-321.
HTML Version. 0304
BibRef

Guan, S.U.[Sheng-Uei], Xie, P.[Pin],
A golden block self-generating scheme for continuous patterned wafer inspections,
CIAP99(436-441).
IEEE DOI Link 9909
BibRef

Zoroofi, R.A.[Reza Aghaeizadeh], Taketani, H.[Hisashi], Tamura, S.[Shinichi], Sato, Y.[Yoshinobu], Sekiya, K.[Kazuma],
Automated inspection of IC wafer contamination,
PR(34), No. 6, June 2001, pp. 1307-1317.
WWW Version. 0103
BibRef

van Dop, E.R.[Erik R.], Regtien, P.P.L.[Paul P.L.],
Multi-sensor recognition of electronic components,
MVA(12), No. 5, 2001, pp. 213-222.
HTML Version. 0103
BibRef

Ye, Q.Z., Ong, S.H., Han, X.,
A stereo vision system for the inspection of IC bonding wires,
IJIST(11), No. 4, 2001, pp. 254-262.
WWW Version. 0105
BibRef

Bréhélin, L.[Laurend], Gascuel, O.[Olivier], Caraux, G.[Gilles],
Hidden Markov Models with Patterns to Learn Boolean Vector Sequences and Application to the Built-In Self-Test for Integrated Circuits,
PAMI(23), No. 9, September 2001, pp. 997-1008.
IEEE Abstract.
IEEE DOI Link 0110
Variation of HMM. BibRef

Qu, G.Y.[Gong-Yuan], Wood, S.L.[Sally L.], Teh, C.[Cho],
Wafer Defect Detection Using Directional Morphological Gradient Techniques,
JASP(2002), No. 7, July 2002, pp. 686-703. 0208
BibRef

Tobin, K.W.[Kenneth W.], Karnowski, T.P.[Thomas P.], Arrowood, L.F.[Lloyd F.], Ferrell, R.K.[Regina K.], Goddard, J.S.[James S.], Lakhani, F.[Fred],
Content-Based Image Retrieval for Semiconductor Process Characterization,
JASP(2002), No. 7, July 2002, pp. 704-713. 0208
BibRef

Tsai, D.M., Chou, C.C.,
A fast focus measure for video display inspection,
MVA(14), No. 3, July 2003, pp. 192-196.
WWW Version. 0308
BibRef

Roh, Y.J.[Young Jun], Park, W.S.[Won Shik], Cho, H.S.[Hyung-Suck],
Correcting image distortion in the X-ray digital tomosynthesis system for PCB solder joint inspection,
IVC(21), No. 12, November 2003, pp. 1063-1075.
WWW Version. 0310
BibRef

Baidyk, T., Kussul, E., Makeyev, O., Caballero, A., Ruiz, L., Carrera, G., Velasco, G.,
Flat image recognition in the process of microdevice assembly,
PRL(25), No. 1, January 2004, pp. 107-118.
WWW Version. 0311
BibRef

Toledo, G.K.[Gengis K.], Kussul, E.[Ernst], Baidyk, T.[Tatiana],
Neural classifier for micro work piece recognition,
IVC(24), No. 8, August 2006, pp. 827-836.
WWW Version. 0608
Neural network; Object recognition; Position recognition; Microassembly BibRef

Toledo, G.K.[Gengis K.], Kussul, E.[Ernst], Baidyk, T.[Tatiana],
Work piece recognition based on the permutation neural classifier technique,
MVA(22), No. 3, May 2011, pp. 495-504.
WWW Version. 1104
BibRef

Fang, T.[Tong], Jafari, M.A.[Mohsen A.], Danforth, S.C.[Stephen C.], Safari, A.[Ahmad],
Signature analysis and defect detection in layered manufacturing of ceramic sensors and actuators,
MVA(15), No. 2, December 2003, pp. 63-75.
Springer DOI Link 0401
BibRef

Zervakis, M.E., Goumas, S.K., Rovithakis, G.A.,
A Bayesian Framework for Multilead SMD Post-Placement Quality Inspection,
SMC-B(34), No. 1, February 2004, pp. 440-453.
IEEE Abstract. 0403
BibRef
Earlier: A2, A3, A1:
A Bayesian image analysis framework for post-placement quality inspection of components,
ICIP02(II: 549-552).
IEEE Abstract. 0210
BibRef

Kubota, T.[Toshiro], Talekar, P.[Parag], Ma, X.Y.[Xian-Yun], Sudarshan, T.S.[Tangali S.],
A nondestructive automated defect detection system for silicon carbide wafers,
MVA(16), No. 3, May 2005, pp. 170-176.
Springer DOI Link 0505
BibRef

di Palma, F., de Nicolao, G., Miraglia, G., Pasquinetti, E., Piccinini, F.,
Unsupervised spatial pattern classification of electrical-wafer-sorting maps in semiconductor manufacturing,
PRL(26), No. 12, September 2005, pp. 1857-1865.
WWW Version. 0508
BibRef

Shankar, N.G., Zhong, Z.W.,
Improved segmentation of semiconductor defects using area sieves,
MVA(17), No. 1, April 2006, pp. 1-7.
Springer DOI Link 0604
BibRef

Lin, H.D.[Hong-Dar],
Tiny surface defect inspection of electronic passive components using discrete cosine transform decomposition and cumulative sum techniques,
IVC(26), No. 5, May 2008, pp. 603-621.
WWW Version. 0803
Tiny surface defect inspection; Electronic passive components; Discrete cosine transform decomposition; Cumulative sum technique BibRef

Watanabe, T.[Takashi], Kusano, A.[Akira], Fujiwara, T.[Takayuki], Koshimizu, H.[Hiroyasu],
3D Precise Inspection of Terminal Lead for Electronic Devices by Single Camera Stereo Vision,
IEICE(E91-D), No. 7, July 2008, pp. 1885-1892.
WWW Version. 0807
BibRef

Last, M.[Mark], Kandel, A.[Abraham],
Perception-based Analysis Of Engineering Experiments In The Semiconductor Industry,
IJIG(2), No. 1, January 2002, pp. 107-126. 0201
BibRef

Ng, A.N.Y.[Ada N.Y.], Lam, E.Y.[Edmund Y.], Chung, R.[Ronald], Fung, K.S.M.[Kenneth S.M.], Leung, W.H.,
Reference-free Machine Vision Inspection Of Semiconductor Die Images,
IJIG(9), No. 1, January 2009, pp. 133-152. 0903
BibRef

Chen, C.S.[Chin-Sheng], Yeh, C.W.[Chun-Wei], Yin, P.Y.[Peng-Yeng],
A novel Fourier descriptor based image alignment algorithm for automatic optical inspection,
JVCIR(20), No. 3, April 2009, pp. 178-189.
Elsevier DOI Link
WWW Version. 0903
Fourier descriptor; Image alignment; Automatic optical inspection; Component detection; Contour tracing; Run length encoding; Blobs tables; Phase-shifted technique BibRef

Chang, C.Y., Li, C.H., Lin, S.Y., Jeng, M.,
Application of Two Hopfield Neural Networks for Automatic Four-Element LED Inspection,
SMC-C(39), No. 3, May 2009, pp. 352-365.
IEEE DOI Link 0904
BibRef

Tsai, D.M.[Du-Ming], Chang, C.C.[Chih-Chieh], Chao, S.M.[Shin-Min],
Micro-crack inspection in heterogeneously textured solar wafers using anisotropic diffusion,
IVC(28), No. 3, March 2010, pp. 491-501.
Elsevier DOI Link
WWW Version. 1001
Defect detection; Heterogeneous texture; Anisotropic diffusion; Micro-crack; Solar wafer BibRef

Zontak, M.[Maria], Cohen, I.[Israel],
Defect detection in patterned wafers using anisotropic kernels,
MVA(21), No. 2, February 2010, pp. xx-yy.
Springer DOI Link 1002
BibRef

Sun, T.H.[Te-Hsiu], Tseng, C.C.[Chun-Chieh], Chen, M.S.[Min-Sheng],
Electric contacts inspection using machine vision,
IVC(28), No. 6, June 2010, pp. 890-901.
Elsevier DOI Link
WWW Version. 1003
Machine vision; Surface defects; Electric contact; Computer vision; Quality control BibRef

Fan, S.K.S.[Shu-Kai S.], Chuang, Y.C.A.[Yu-Chi-Ang],
Automatic detection of Mura defect in TFT-LCD based on regression diagnostics,
PRL(31), No. 15, 1 November 2010, pp. 2397-2404.
Elsevier DOI Link
WWW Version. 1003
TFT-LCD manufacturing; Mura defect detection; Regression diagnostics; PRESS residuals BibRef

Zhang, J.[Jun], Kim, Y.[Yongsik], Yang, S.H.[Seung-Hune], Milster, T.D.[Tom D.],
Illumination artifacts in hyper-NA vector imaging,
JOSA-A(27), No. 10, October 2010, pp. 2272-2284.
WWW Version. 1011
In microscopic system for photomask, wafer analysis. BibRef

He, X.F.[Xing-Fei], and Fang, F.[Frank],
Flat-Panel Color Filter Inspection,
VisSys(16), No. 5, May 2011, pp. xx-yy.
HTML Version. 1107
Inspection of flat-panel displays with line-scan cameras BibRef

Benedek, C.[Csaba],
Detection of soldering defects in Printed Circuit Boards with Hierarchical Marked Point Processes,
PRL(32), No. 13, 1 October 2011, pp. 1535-1543.
Elsevier DOI Link
WWW Version. 1109
Marked Point Process; PCB; Scooping BibRef

Peng, Y.[Yao], Zhang, J.[Jinyu], Wang, Y.[Yan], Yu, Z.P.[Zhi-Ping],
Gradient-Based Source and Mask Optimization in Optical Lithography,
IP(20), No. 10, October 2011, pp. 2856-2864.
IEEE DOI Link 1110
BibRef

Long, T.[Ting], Wang, H.[Houjun], Long, B.[Bing],
Test generation algorithm for analog systems based on support vector machine,
SIViP(5), No. 4, November 2011, pp. 527-533.
WWW Version. 1111
Circuit testing. BibRef

Kimura, Y.[Yuta], Takauji, H.[Hidenori], Kaneko, S.[Shun'ichi], Domae, Y.[Yukiyasu], Okuda, H.[Haruhisa],
Shape recognition of flexible cables by Outer Edge FCM clustering,
FCV11(1-5).
IEEE DOI Link 1102
BibRef

Takagi, Y.[Yuji], Asano, T.[Toshio], Liu, W.[Wei], Yao, J.[Jun],
Color uniformity evaluation of electronic displays based on visual sensitivity,
FCV11(1-5).
IEEE DOI Link 1102
BibRef

Jia, N.N.[Ning-Ning], Lam, E.Y.[Edmund Y.],
Stochastic gradient descent for robust inverse photomask synthesis in optical lithography,
ICIP10(4173-4176).
IEEE DOI Link 1009
BibRef

Buddhachan, V.[Varunyou], KaewTrakulPong, P.[Pakorn],
Machine Vision for Excess Gluing Inspection in Spindle Motor Assembly,
MVA09(304-).
PDF Version. 0905
BibRef

Ibrahim, A.[Abdelhameed], Tominaga, S.[Shoji], Horiuchi, T.[Takahiko],
Unsupervised Material Classification of Printed Circuit Boards Using Dimension-Reduced Spectral Information,
MVA09(435-).
PDF Version. 0905
BibRef

Kryszczuk, K.[Krzysztof], Hurley, P.[Paul], Sayah, R.[Robert],
Direct Printability Prediction in VLSI Using Features from Orthogonal Transforms,
ICPR10(2764-2767).
IEEE DOI Link 1008
VSLI layout analysis. BibRef

Lichtenauer, M.S.[Matthias Scheller], Avelar, S.[Silvania], Toporek, G.[Grzegorz],
Segmentation of Images of Lead Free Solder,
ICISP10(165-172).
Springer DOI Link 1006
BibRef

Duan, G.F.[Gui-Fang], Chen, Y.W.[Yen-Wei],
Improved Active Shape Model for automatic optical phase identification of microdrill bits in Printed Circuit Board production,
ICIP09(425-428).
IEEE DOI Link 0911
BibRef

Li, T.Z.[Tian-Ze], Wen, F.[Fang], Lu, H.W.[Heng-Wei], Ma, L.X.[Li-Xiu],
Study on the Treatment Technology and Application of Charge Coupled Device,
CISP09(1-5).
IEEE DOI Link 0910
BibRef

Pieters, R.[Roel], Jonker, P.P.[Pieter P.], Nijmeijer, H.[Henk],
Real-Time Center Detection of an OLED Structure,
ACIVS09(400-409).
Springer DOI Link 0909
Servoing using image input. BibRef

Liu, X.[Xun], Yang, L.X.[Li-Xia],
Study on virtual simulation of chip during manufacturing,
IASP09(346-350).
IEEE DOI Link 0904
BibRef

Nedzved, A., Ablameyko, S., Belotserkovsky, A., Maziewski, A., Dobrogowski, W.,
The structure analysis of ultra thin magnetic film images,
ICPR08(1-4).
IEEE DOI Link 0812
BibRef

Huttunen, H.[Heikki], Ruusuvuori, P.[Pekka], Manninen, T.[Tapio], Rutanen, K.[Kalle], Ronkka, R.[Risto], Visa, A.[Ari],
Object detection for dynamic adaptation of interconnections in inkjet printed electronics,
ICIP08(2364-2367).
IEEE DOI Link 0810
BibRef

Leta, F.R., Feliciano, F.F.,
Computational system to detect defects in mounted and bare PCB Based on connectivity and image correlation,
WSSIP08(331-334).
IEEE DOI Link 0806
BibRef

Shortis, M.R., Johnston, G.H.G., Pottler, K., Lüpfert, E.,
Photogrammetric Analysis of Solar Collectors,
ISPRS08(B5: 81 ff).
PDF Version. 0807
BibRef

Wang, D.Z.[Da-Zhi], Wu, C.H.[Chun-Ho], Ip, A.[Andrew], Chan, C.Y.[Ching-Yuen], Wang, D.W.[Ding-Wei],
Fast Multi-template Matching Using a Particle Swarm Optimization Algorithm for PCB Inspection,
EvoIASP08(xx-yy).
Springer DOI Link 0804
BibRef

Lin, H.D.[Hong-Dar], Chiu, S.W.[Singa Wang],
Computer-Aided Vision System for MURA-Type Defect Inspection in Liquid Crystal Displays,
PSIVT06(442-452).
Springer DOI Link 0612
BibRef

Oda, M.[Masayoshi], Nishio, Y.[Yoshifumi], Ushida, A.[Akio],
Spatial-temporal Analysis Method of Plane Circuits Based on Two-Layer Cellular Neural Networks,
IWICPAS06(195-204).
Springer DOI Link 0608
Analysis of circuits. BibRef

Bourgeata, P., Meriaudeaua, F.,
Classifier Vote and Gabor Filter Banks for Wafer Segmentation,
ICIP05(I: 369-372).
IEEE DOI Link 0512
BibRef

Ho, W.K.[Weng Khuen], Tay, A., Zhou, Y.[Ying], Yang, K.[Kai], Hu, N.[Ni],
Detection of wafer warpages during thermal processing in microlithography,
ICARCV04(I: 485-490).
IEEE DOI Link 0412
BibRef

El Doker, T.A., King, J., Scott, D.R.,
Initial results on the development of a new wafer inspection paradigm,
Southwest04(124-127).
IEEE Abstract. 0411
BibRef

Horiuchi, T.[Takahiko], Suzuki, Y.[Yuhei], Tominaga, S.[Shoji],
Material Classification for Printed Circuit Boards by Kernel Fisher Discriminant Analysis,
CCIW11(152-164).
Springer DOI Link 1104
BibRef

Ibrahim, A.[Abdelhameed], Tominaga, S.[Shoji], Horiuchi, T.[Takahiko],
Spectral Invariant Representation for Spectral Reflectance Image,
ICPR10(2776-2779).
IEEE DOI Link 1008
BibRef
Earlier:
Material Classification for Printed Circuit Boards by Spectral Imaging System,
CCIW09(216-225).
Springer DOI Link 0903
BibRef

Tominaga, S., Okamoto, S.,
Reflectance-based material classification for printed circuit boards,
CIAP03(238-243).
IEEE Abstract. 0310
BibRef

Choi, K.S.[Kang-Sun], Pyun, J.Y.[Jae-Young], Kim, N.H.[Nam-Hyeong], Choi, B.D.[Byeong-Doo], Ko, S.J.[Sung-Jea],
Real-Time Inspection System for Printed Circuit Boards,
DAGM03(458-465).
HTML Version. 0310
BibRef

Hiroi, T., Shishido, C.[Chie], Watanabe, M.,
Pattern alignment method based on consistency among local registration candidates for LSI wafer pattern inspection,
WACV02(257-263).
IEEE Abstract. 0303
BibRef

Shimoda, A., Iwata, H., Shibata, Y., Ikeda, H.,
Thin Film Magnetic Head Wafer Inspection Technique Using Geometrical Feature Based Image Comparison,
MVA98(xx-yy). BibRef 9800

Chang, M.C., Chen, H.Y., Fuh, C.S.,
Fast Search Algorithms for IC Printed Mark Quality Inspection,
MVA98(xx-yy). BibRef 9800

Marino, P., Dominguez, M.A.,
Feature Extraction for Electronic Equipment Manufacturing,
MVA98(xx-yy). BibRef 9800

Gleason, S.S., Tobin, K.W.,
Directional dilation for the connection of piece-wise objects: A semiconductor manufacturing case study,
ICIP96(III: 9-12).
IEEE DOI Link 9610
BibRef

Lu, Y.[Yi], Tisler, A.,
Machine Vision Inspection of VF Display Boards,
ICPR96(III: 839-843).
IEEE DOI Link 9608
(Univ. of Michigan, USA) BibRef

Doi, H.[Hideaki], Suzuki, Y.[Yoko], Hara, Y.[Yasuhiko], Iida, T.[Tadashi], Fujishita, Y.[Yasuhiro], Karasaki, K.[Koichi],
Real-Time X-Ray Inspection of 3D Defects in Circuit Board Patterns,
ICCV95(575-582).
IEEE DOI Link
IEEE DOI Link BibRef 9500

Duin, R.P.W.[Robert P. W.], Hoek, E.T.G.[Edwin T. G.],
SMD position measurement by a Kohonen network compared with image processing,
CAIP95(606-611).
Springer DOI Link 9509
SMD: Surface Mounted Device. BibRef

Darboux, M.[Michel], Dinten, J.M.[Jean-Marc],
Development of an automated bond verification system for advanced electronic packages,
CIAP95(737-742).
Springer DOI Link 9509
BibRef

Cook, B.D., Lee, S.Y.[Soo-Young],
Fast exposure simulation for large circuit patterns in electron beam lithography,
ICIP95(I: 442-445).
IEEE DOI Link 9510
BibRef

Hiroi, T., Maeda, S., Kubota, H., Watanabe, K., Nakagawa, Y.,
Precise visual inspection for LSI wafer patterns using subpixel image alignment,
WACV94(26-34).
IEEE Abstract. 0403
BibRef

Thibadeau, R.H.[Robert H.],
Printed Circuit Board inspection,
CMU-RI-TR-81-8, 1981, CMU Robotics Institute. Survey, Inspection. Inspection, PCB - Survey. Survey of various techniques - expand contract and see the different areas, table lookup of patterns (difficult), spatial entropy, run lengths (most are in certain range, others are errors), FFT analysis, analysis of edge coding. The goal seems to be to try many alternatives and use results to analyze defects. BibRef 8100

Thibadeau, R.H.[Robert H.], Friedman, M.[Mark], and Seto, J.[John],
Automatic Inspection for Printed Wiring,
CMU-RI-TR-82-16, 1982, CMU Robotics Institute, Presented at the Institute for Interconnecting and Package Electronic Circuits, Fall Meeting, San Diego, CA, October 3, 1982. Inspection, PCB. An outline of the considerations for a semi-automated PCB inspection station that is being built at Westinghouse and the RI. He mentions that there are 4 other systems that have been announced by other companies for sale (Hughes, Itek, Automation Engineering, Elron). BibRef 8210

Ninomiya, T., Yoshimura, K., Nomoto, M., Nakagawa, Y.,
Automatic Printed Circuit Pattern Inspection Using Connectivity Preserving Image Reduction and Connectivity Comparison,
ICPR92(I:53-56).
IEEE DOI Link BibRef 9200

Chehdi, K., Corazza, M.,
Automatic System of Quality Control of Hybrid Circuits by Image Analysis,
ICPR92(I:433-436).
IEEE DOI Link BibRef 9200

Khotanzad, A., Banerjee, H., Srinath, M.,
A vision system for inspection of ball bonds in integrated circuits,
WACV92(290-297).
IEEE Abstract. 0403
BibRef

Khalaj, B.H., Aghajan, H.K., Kailath, T.,
Automated direct patterned wafer inspection,
WACV92(266-273).
IEEE Abstract. 0403
BibRef

Dainis, III, G.A., Ward, M.O.,
Rule-Based Inspection of Leadframes,
CVPR88(580-585).
IEEE Abstract. BibRef 8800

Chapter on Implementations and Applications, Databases, QBIC, Video Analysis, Hardware and Software, Inspection continues in
Inspection -- Solder Joints, Welding, Pipes .

Last update:Feb 8, 2012 at 11:25:05